 |
Tokyo, January 18, 2005 — Casio Computer Co., Ltd. and Renesas
Technology Corp. have agreed to an arrangement whereby Casio will
license its wafer level package (WLP) semiconductor device packaging
technology to Renesas Technology.
The agreement marks the first time Casio has made its WLP technology
available to another Japanese semiconductor device manufacturer.
The main points of the agreement are:
1. Casio will make its WLP technology available to Renesas Technology
on an ongoing basis. Renesas Technology will make active use of WLP
in the fabrication of its semiconductor devices.
2. Renesas Technology will be authorized to manufacture and sell chip
size package (CSP)* products employing
WLP, both on its own and through its subsidiaries.
WLP is a new technology for semiconductor devices that enables rerouting
of the copper traces and encapsulation of the chips in epoxy resin
while the wafer is intact. There is an increasing demand for electronic
products that are more compact and offer a high level of performance,
and WLP technology is ideal for applications such as mobile phones
and digital cameras. Casio’s group company CASIO Micronics is
already using Renesas Technology semiconductor devices that have been
processed using WLP in its products.
Renesas Technology also has an in-house developed wafer process package
(WPP) technology. Like WLP, it enables rerouting of the copper traces
while in the wafer stage and is used in the manufacture of CSP devices.
The license agreement with Casio will enable Renesas Technology to
better meet the requirements of its customers by offering a broader
array of package options.
Both Casio and Renesas Technology anticipate that the present agreement
will lead to an even stronger relationship between the two companies
in future.
| * |
Chip
Size Package (CSP): CSP is a semiconductor package that has
roughly the same external dimensions as the bare chip. Such
packages are used in all sorts of compact and lightweight electronic
products. Mobile phones are a typical example. |
|
|
Site Help
Top of Page
Privacy Policy